Photomask (CCD,DRAM,LCD,MEMS,etc.) irregularity speckle detection inspection SD2000Mk2(Patent:2124747)

Product outline:
The irregularity of the mask can be detected by
nanometer order.
The resolution limit of the optical system by visible
light is decided by numerical aperture NA of the
optical system and the wavelength λ.
In the high resolution microscope that uses NA=0.9
(maximum level of NA) and the wavelength of
purple illuminate 436 nm,
R (resolution)= 0.61λ / NA = 0.3μm.
SD2000Mk2 enables the mask irregularity detection
of 10 nm with the optical system for magnification
2 and NA0.035 by the company own super
resolution technology.

Object mask : Binary mask for imaging device
The magnifications : Magnification 2
NA : 0.035
Illumination wavelength : 564nm
Illumination type : Special oblique lighting
Inspection item : Irregularity of drawing, Defect of LCD
Inspection time : 20min
Ability of measurement : 10nm
Ability of the visualization : 2nm
Target area : 3mm square
*Externals and specifications are subject to change without prior notice for the improvement.

Automatic Bevel Inspection YPI-300EDGE
YPI-300EDGE provides high speed high resonance inspection down to 0.152μm defects on wafer bevel.
Compact and low cost design meet R&D and mass production requirement.

Optic : Laser light Scattering
Light Source : Semiconductor Laser
Sensor : High resolution low dark current photo diode
Defect Chanel : 5 channels / Minimum defect size 0.152μm
Work Size : 300�o，200�o
Scan Method : Wafer Rotation & Sensor head Rotation
Measurement Area : Front-50�o from edge,
Back-30�o from edge Bevel Apex
Repeatability : ＞90%
Throughput : 60 wafer / hour
Data Process Soft : Mapping / Graph, Data storage
Dimension : 1410�o (W)× 1900�o (H)× 2000�o (D)
Weight : 600kg
Power : AC220V, 50/60 Hz, 3 phase 1.5KVA
Option : GEM300

Particle Scanner for LCD glass and thin films
Application:
1. Particle monitor after cleaning
2. Particle monitor for deposition
3. Particle monitor for cleanroom

Monitor up to 0.3 micron by Laser light scattering
Separate particle monitoring at front and back side
Automatic distance control for substrate deflection
Adjustable for substrate size of 100mm x 100mm to 500mm x 500mm
High speed, small foot print, low cost.

D-process CMP equipment features wide range of head pressure and rotation speed for advanced low-k materials in ULSI manufacturing and highly up-down structures in MEMS devices;